TY  - GEN
AD  - Oregon Health and Science University
AU  - Peter, Geoffrey J.M.
DA  - 2001
DO  - 10.6083/M49W0CDH
DO  - DOI
ID  - 129
KW  - Semiconductors
KW  - electronic packaging
KW  - thermal properties
KW  - integrated circuits
KW  - junctions
L1  - https://digitalcollections.ohsu.edu/record/129/files/129_etd.pdf
L2  - https://digitalcollections.ohsu.edu/record/129/files/129_etd.pdf
L4  - https://digitalcollections.ohsu.edu/record/129/files/129_etd.pdf
LK  - https://digitalcollections.ohsu.edu/record/129/files/129_etd.pdf
PB  - Oregon Health and Science University
PY  - 2001
T1  - Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects
TI  - Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects
UR  - https://digitalcollections.ohsu.edu/record/129/files/129_etd.pdf
Y1  - 2001
ER  -