000000129 001__ 129
000000129 005__ 20231130114538.0
000000129 0247_ $$2DOI$$a10.6083/M49W0CDH
000000129 037__ $$aETD
000000129 245__ $$aNumerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects
000000129 260__ $$bOregon Health and Science University
000000129 269__ $$a2001
000000129 336__ $$aDissertation
000000129 502__ $$bPh.D.
000000129 540__ $$fCC BY
000000129 542__ $$fIn copyright - single owner
000000129 650__ $$aSemiconductors$$025858
000000129 6531_ $$aelectronic packaging
000000129 6531_ $$athermal properties
000000129 6531_ $$aintegrated circuits
000000129 6531_ $$ajunctions
000000129 691__ $$aOGI School of Science and Engineering$$041365
000000129 692__ $$aDepartment of Materials Science and Engineering$$041420
000000129 7001_ $$aPeter, Geoffrey J.M.
000000129 7001_ $$uOregon Health and Science University$$041354
000000129 8564_ $$9ac41b4c4-85a2-4faf-a22d-f0b86c4b6c41$$s9453978$$uhttps://digitalcollections.ohsu.edu/record/129/files/129_etd.pdf
000000129 905__ $$a/rest/prod/4x/51/hj/01/4x51hj01t
000000129 909CO $$ooai:digitalcollections.ohsu.edu:129$$pstudent-work
000000129 980__ $$aTheses and Dissertations