TY  - GEN
DO  - 10.6083/M4PN93VF
DO  - DOI
AD  - Oregon Graduate Institute of Science and Technology
T1  - Passivation behavior of copper thin films for electrochemical planarization application
DA  - 1999
AU  - Dianatkhah, Kambiz
L1  - https://digitalcollections.ohsu.edu/record/1838/files/2541_etd.pdf
PB  - Oregon Graduate Institute of Science and Technology
PY  - 1999
ID  - 1838
L4  - https://digitalcollections.ohsu.edu/record/1838/files/2541_etd.pdf
KW  - Copper
KW  - integrated circuits
KW  - metallic films
KW  - passivation
TI  - Passivation behavior of copper thin films for electrochemical planarization application
Y1  - 1999
L2  - https://digitalcollections.ohsu.edu/record/1838/files/2541_etd.pdf
LK  - https://digitalcollections.ohsu.edu/record/1838/files/2541_etd.pdf
UR  - https://digitalcollections.ohsu.edu/record/1838/files/2541_etd.pdf
ER  -