000001838 001__ 1838
000001838 005__ 20231130114552.0
000001838 0247_ $$2DOI$$a10.6083/M4PN93VF
000001838 037__ $$aETD
000001838 245__ $$aPassivation behavior of copper thin films for electrochemical planarization application
000001838 260__ $$bOregon Graduate Institute of Science and Technology
000001838 269__ $$a1999
000001838 336__ $$aDissertation
000001838 502__ $$bM.S.
000001838 540__ $$fCC BY
000001838 542__ $$fIn copyright - single owner
000001838 650__ $$aCopper$$017086
000001838 6531_ $$aintegrated circuits
000001838 6531_ $$ametallic films
000001838 6531_ $$apassivation
000001838 692__ $$aDepartment of Materials Science and Engineering$$041420
000001838 7001_ $$aDianatkhah, Kambiz
000001838 7001_ $$uOregon Graduate Institute of Science and Technology$$041352
000001838 8564_ $$95905d823-5036-4318-ade3-8d15bedbb62d$$s20562134$$uhttps://digitalcollections.ohsu.edu/record/1838/files/2541_etd.pdf
000001838 905__ $$a/rest/prod/9z/90/30/01/9z903001z
000001838 909CO $$ooai:digitalcollections.ohsu.edu:1838$$pstudent-work
000001838 980__ $$aTheses and Dissertations