TY  - THES
AD  - Oregon Health and Science University
AU  - Huo, Jinshan
DA  - 2004
DO  - 10.6083/M4028PFN
DO  - DOI
ID  - 209
KW  - Copper
KW  - Semiconductors
KW  - electrolytic polishing
KW  - microelectronics
L1  - https://digitalcollections.ohsu.edu/record/209/files/209_etd.pdf
L2  - https://digitalcollections.ohsu.edu/record/209/files/209_etd.pdf
L4  - https://digitalcollections.ohsu.edu/record/209/files/209_etd.pdf
LK  - https://digitalcollections.ohsu.edu/record/209/files/209_etd.pdf
PB  - Oregon Health and Science University
PY  - 2004
T1  - Electrochemical planarization of copper for microelectronic applications
TI  - Electrochemical planarization of copper for microelectronic applications
UR  - https://digitalcollections.ohsu.edu/record/209/files/209_etd.pdf
Y1  - 2004
ER  -