@article{ETD,
      recid = {339},
      author = {Meyer, William K. and },
      title = {Electromigration of Damascene copper for IC interconnect},
      publisher = {Oregon Health and Science University},
      school = {Ph.D.},
      address = {2004},
      number = {ETD},
      url = {http://digitalcollections.ohsu.edu/record/339},
      doi = {https://doi.org/10.6083/M42805JF},
}