Go to main content

Effect of thiols and their aging on Cu electrodeposition for ULSI interconnects

Zhi, Charlie
2002
Get Accessible Copy
Download
Add to Basket

Six model thiols, Bis-(3-Sulfopropy1)-disulfide sodium salt (SPS), 3-Mercapto-l- propanesulfonic sodium salt (MPS), (O-Ethyldithiocarbonato)-s-(3-sulfoproplyl)-ester potassium salt(OPX), 3-S-Isothiuronium Propyl Sulfonate(UPS), N, N-Dimethyl- dithiocarbarnylpropyl sulfonic sodium salt (DPS), and 3 (Benzothiazolyl-2-mercapto)-propyl-sulfonic sodium salt (ZPS) in an acid-copper plating bath containing chloride ions and polyethylene glycol (PEG) have been systematically evaluated and characterized by electrochemical method and by fill study.

Title
Effect of thiols and their aging on Cu electrodeposition for ULSI interconnects
Creator
Zhi, Charlie : Oregon Health and Science University
Contributor
Solanki, Rajendra : Advisor : Oregon Graduate Institute of Science and Technology
Publisher
Oregon Health and Sciences University
Date
2002-02-01
Subjects
DOI
https://doi.org/10.6083/M40P0XBC
Content Type
Dissertation
Degree Type
Ph.D.
Department
OGI Department of Electrical and Computer Engineering
School
OGI School of Science and Engineering
Copyright Status
Record ID
2474
Record Created
2023-06-29
Disclaimer

These documents are archival records. They are retained for historical reference only.

Need an accessible version? Use the ‘Get Accessible Copy’ link above.

Record Appears in
OHSU Works > Student Work > Degrees > Doctor of Philosophy (Ph.D.)
Organizations > Schools > OGI School of Science and Engineering (2001-2008)
Theses and Dissertations
Featured Collections
Dissertations
All Records

Metric
From
To
Interval
Export
Download Full History