Effect of thiols and their aging on Cu electrodeposition for ULSI interconnects
2002
Files
Details
Title
Effect of thiols and their aging on Cu electrodeposition for ULSI interconnects
Creator
Zhi, Charlie C.
Oregon Health and Science University
Oregon Health and Science University
Publisher
Oregon Health and Sciences University
Oregon Health and Science University
Oregon Health and Science University
Date
2002-02-01
Content Type
Dissertation
Degree Type
Ph.D.
School
OGI School of Science and Engineering
Copyright Status
Record ID
2474
Record Created
2023-06-29